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TSB12LV01AIPZ specifiche: HIGH PERFORMANCE 3.3V LINK LAYER WITH 32-BIT HOST I/F, 2K FIFOS
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TSB12LV01AIPZ datasheet e spec
Fabbricante : TI
Viaggi : PZ
Pins : 100
Temperatura : Min -40 °C | Max 85 °C
Dimensione : 293 KB
Applicazione : HIGH PERFORMANCE 3.3V LINK LAYER WITH 32-BIT HOST I/F, 2K FIFOS
TSB12LV01AIPZ PDF Download
